ELECTRONIC COMPONENT CLEANING METHOD

Abstract: an electronic component cleaning method for performing cleaning on a surface of a wafer includes: a wet cleaning process of performing wet cleaning on the surface of the wafer by hydrogen water and pure water; a dry cleaning process of performing dry cleaning on the surface of an electronic component by atmospheric-pressure plasma after the wet cleaning; and a hydrogen water treatment process of performing cleaning on the surface of the wafer using hydrogen water obtained by dissolving hydrogen gas into water, after the dry cleaning process.

Inventor(s): HIROSHI KIKUCHI, JIN LI, Junichi IDA

CPC Classification: B08B3/12 (by sonic or ultrasonic vibrations (washing or rinsing machines for crockery or tableware using sonic or ultrasonic waves ; of natural teeth, of prostheses using ultrasonic techniques similar to those used for natural teeth ; application of ultrasonic vibrations to chemical, physical or physico-chemical processes in general ))

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