20250195345. Whipped Formulations (FORMULATED SOLUTIONS, LLC)
WHIPPED FORMULATIONS
Abstract: the present disclosure relates to, inter alia, a formulation in a package. the formulation comprises one or more active agents and is co-mingled with a whipping agent prior to being filled under pressure into the package. the whipping agent is added in sufficient amounts to be dispersed in the formulation. the pressurized package is under sufficient pressure suitable to maintain the whipping agent dispersed in the formulation; and the pressurized package is under sufficient pressure to expel the formulation as a whipped formulation upon application of external force on the formulation in the package.
Inventor(s): Stephen BALDWIN, Scott CARPENTER, Heidi GRAHAM, Nanhye KIM, Tom MEYER, David Reynolds, Jerry Vancleave, Eric DANN, Thomas DANN, Renee NELSON, Brian DANN
CPC Classification: A61K8/046 ({Aerosols; Foams})
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- Patent Applications
- FORMULATED SOLUTIONS, LLC
- CPC A61K8/046
- Stephen BALDWIN of Flanders NJ US
- Scott CARPENTER of Palm Harbor FL US
- Heidi GRAHAM of Charlottesville VA US
- Nanhye KIM of New Providence NJ US
- Tom MEYER of Germantown TN US
- David Reynolds of Ooltewah TN US
- Jerry Vancleave of Lakeland TN US
- Eric DANN of Safety Harbor FL US
- Thomas DANN of Palm Harbor FL US
- Renee NELSON of Brandon FL US
- Brian DANN of Clearwater FL US