POLYIMIDE RESIN PRECURSOR

Abstract: a polyimide resin precursor that yields a polyimide resin having a low dielectric loss tangent and excelling in a chemical resistance property; a production method for the polyimide resin precursor; a photosensitive resin composition including the polyimide resin precursor as a polymerizable resin a patterned resin film using the photosensitive resin composition, and a production method for the patterned polyimide resin film. a polymer of a diamine compound and a dicarboxylic acid which is a reactant with a tetracarboxylic dianhydride and an alcohol is used as the polyimide resin precursor, and a compound that either has a combination of a secondary hydroxyl group and an ethylenically unsaturated double bond, or has a combination of a methylol group and an ethylenically unsaturated double bond, is used as the aforementioned alcohol.

Inventor(s): Kazuaki Ebisawa

CPC Classification: G03F7/0387 ({Polyamides or polyimides})

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