TEST METHOD FOR A WAFER AND WAFER

Abstract: a test method for a wafer is provided. first, data of an optical characteristic of a test key of the wafer is acquired using an optical scatterometer. the wafer has chip areas and a frame area surrounding and separating the chip areas. the test key is disposed in the frame area. then, the data is compared with corresponding data of a standard sample without a crack, and a difference between the data and the corresponding date is obtained. it is determined that a crack is formed in the test key and a crack condition in the chip areas does not meet a criterion of the wafer when the difference is larger than a tolerance. it is determined that the crack condition in the chip areas meets the criterion of the wafer when the difference is smaller than or equal to the tolerance.

Inventor(s): Ying TONG

CPC Classification: G01N21/9505 (INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing processes other than immunoassay, involving enzymes or microorganisms , ))

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