METHOD OF MANUFACTURING STRUCTURE HAVING ANODIZED PARTS

Abstract: a method of manufacturing a structure having anodized parts includes: forming a bottom metal pattern with a dielectric layer thereon on a substrate, in which the dielectric layer has an opening exposing the bottom metal pattern; forming a semiconductor layer to cover the dielectric layer; forming a first metal layer on the semiconductor layer; forming a second metal layer on the first metal layer; forming a mask layer on the second metal layer to expose a portion of a top surface of the second metal layer; etching the second metal layer through the mask layer until a top surface of the first metal layer is exposed, in which an etch selectivity of the second metal layer and the first metal layer is greater than 2.0; anodizing the first metal layer through the mask layer to form an anodized segment; and removing the mask layer.

Inventor(s): Li-Yi CHEN, Chieh-Ting CHEN

CPC Classification: C25D11/022 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR)

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