OPTICAL PACKAGE STRUCTURE AND OPTICAL CHIP THEREOF

Abstract: an optical package structure includes a substrate, an optical chip disposed on the substrate, a ring-shaped supporting layer disposed on the optical chip, a light-permeable layer disposed on the ring-shaped supporting layer, and an encapsulant formed on the substrate. the optical chip has a pressure channel arranged therein. two ends of the pressure channel are respectively arranged on an outer surface of the optical chip and are respectively located at two opposite sides of the ring-shaped supporting layer. the light-permeable layer, the ring-shaped supporting layer, and the optical chip are embedded in the encapsulant and jointly define an air chamber that is in fluid communication with the pressure channel. the encapsulant encloses the pressure channel, and the air chamber is enclosed.

Inventor(s): YU-HSIANG LIU, LI-CHUN HUNG

CPC Classification: H10F77/50 (No explanation available)

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