METHOD OF PROCESSING A SUBSTRATE AND METHOD OF FABRICATING BIT LINE CONTACTS OVER THE SUBSTRATE

Abstract: the present application provides a method of processing a substrate and a method of fabricating bit line contacts over the substrate. the method of processing the substrate includes steps of forming a photosensitive layer on the substrate; performing a first exposure process to expose the photosensitive layer to actinic radiation through a first mask; performing a first developing process to remove portions of the photosensitive layer exposed to the actinic radiation and form an intermediate pattern; performing a second exposure process to expose the intermediate pattern to the actinic radiation through a second mask; performing a second developing process to remove portions of the intermediate pattern shielded from the actinic radiation and form a target pattern; and performing an etching process to remove portions of the substrate exposed by the target pattern.

Inventor(s): CHIH-YING TSAI, JUI-SENG WANG, YI-YI CHEN

CPC Classification: H10B12/485 (ELECTRONIC MEMORY DEVICES)

Search for rejections for patent application number 20250185235