STRUCTURAL ENCLOSURE FOR PROTECTION AGAINST FOREIGN OBJECT DEBRIS AND RESTRAINT OF THERMAL INTERFACE MATERIAL

Abstract: a system includes a substrate and an electrical component mounted to the substrate. the system also includes a structural enclosure positioned around lateral edges of the electrical component and mounted to the substrate. the structural enclosure includes raised walls extending away from the substrate and surrounding the electrical component. the raised walls are configured to block foreign object debris from the electrical component. the system further includes a lid connected to the substrate, where the lid covers the electrical component and the structural enclosure. the system also includes a seal positioned between the structural enclosure and the lid, where the seal is configured to be compressed when the lid is connected to the substrate. in addition, the system includes a thermal interface material positioned between and contacting the electrical component and the lid.

Inventor(s): Charles Chu, Bruce Vinttran, Paola V. Lopez, Sung H. Lee, Keith R. Burrell, Andrew J. Bristol, Kevin A. Miyamoto

CPC Classification: H05K1/182 (Printed circuits structurally associated with non-printed electric components ({, , , and} take precedence))

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