DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTIVE ELECTRICAL COMPONENTS

Abstract: systems and methods for using a daughter board to deliver power from the power supply to a chip on a host board, where power is converted to a desired voltage (e.g., from a higher voltage to a lower voltage), provided to a daughter board, processed as needed on the daughter board, and delivered to the host board at locations close to the chip. the power is delivered from the daughter board to the host board through connective electrical components which may comprise decoupling capacitors that are soldered between the boards to provide minimized transient response characteristics as well as structural support between the boards, or coaxial connectors that provide reduced inductance and are secured between the boards by structural posts.

Inventor(s): Robert Morris Wilcox, Youngbae Park, Samuel Thompson

CPC Classification: H05K1/145 (Structural association of two or more printed circuits (providing electric connection to or between printed circuits , ))

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