CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

Abstract: a circuit board according to an embodiment includes a first insulating layer including an upper and lower surface; and a first circuit pattern embedded at the upper surface of the first insulating layer, wherein the upper surface of the first insulating layer includes a portion that does not overlap the first circuit pattern in a vertical direction, and the portion of the upper surface of the first insulating layer has a step.

Inventor(s): Myung Jae KWON, Sang Hyuck NAM, Ki Su YEO, Chang Woo YOO

CPC Classification: H05K1/0296 ({Conductive pattern lay-out details not covered by sub groups - ( takes precedence; lay-out adapted to mounted component configuration )})

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