20250185159. Multi-layered Fl (SAMSUNG ELECTRONICS ., .)
MULTI-LAYERED FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
Abstract: a multi-layered flexible printed circuit board is provided. the multi-layered flexible printed circuit board includes a first flexible printed circuit board (fpcb) including a first curved area in which a conductive layer for signal transmission is disposed, and a first dummy area extending from the first curved area, a second fpcb including a second curved area in which a conductive layer for signal transmission is disposed, and a second dummy area extending from the second curved area, and a bonding layer to which the first dummy area and the second dummy area are bonded.
Inventor(s): Youngjin JUNG, Kihwan KWON, Honjeong PARK, Sujin CHO, Woosung CHUN
CPC Classification: H05K1/0277 ({Bendability or stretchability details (, take precedence)})
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