20250183604. Multi-layered Flexible Bus (Stafl Systems, LLC)
MULTI-LAYERED FLEXIBLE BUS BAR
Abstract: a flexible bus bar system for connecting printed circuit boards (pcbs), especially suited for high-power applications. the bus bar is constructed from multiple stacked thin sheets of conductive material, imparting flexibility and reducing mechanical stress on connected pcbs in applications prone to shock and/or vibration, such as electric vehicle power systems. the sheets may be laser-cut, optionally enabling formation of intricate geometries and/or integrated direct mounting apertures, potentially eliminating the need for additional connectors or crimps. one or more radiused curves are introduced into a central portion of the bus bar, holding the layers in alignment and providing flexibility and/or elasticity. the assembly may be reinforced with an adhesive-backed heat shrink. methods of fabrication are also disclosed.
Inventor(s): Benjamin Michael Levy, Andrew Kenji McIntosh, Kadir Toksoy
CPC Classification: H01R25/145 ({Details, e.g. end pieces or joints ( takes precedence)})
Search for rejections for patent application number 20250183604