Mirror image of geometrical patterns in stacked integrated circuit dies

Abstract: an electronic device includes first and second integrated circuit (ic) dies. the first ic die includes a first set of contact pads arranged, on a first surface of the first ic die, in a first geometrical pattern which is non-symmetrical under reflection about a given axis in a plain of the first ic die. the second ic die includes a second set of the contact pads that are arranged, on a second surface of the second ic die, in a second geometrical pattern that is a mirror image of the first geometrical pattern with respect to the given axis, the second surface of the second ic die is flipped about the given axis and facing the first surface of the first ic die, and the contact pads of the first and second sets are aligned with one another and mounted on one another.

Inventor(s): Ido Bourstein

CPC Classification: H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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