SEMICONDUCTOR PACKAGE

Abstract: a semiconductor package includes a buffer die, first and second memory dies, first and second bonding layer structures, first and second molds, and an auxiliary substrate. the first memory dies are stacked on the buffer die. the first bonding layer structure is between the first memory dies, bonds the first memory dies together, and contains a first conductive bonding pattern structure. the first mold is on the buffer die, and covers sidewalls of the first memory dies and the first bonding layer structure. the second bonding layer structure is on the first memory dies and the first mold, and contains a second conductive bonding pattern structure. the second memory die is on the second bonding layer structure. the second mold is on the second bonding layer structure, and covers a sidewall of the second memory die. the auxiliary substrate is on the second memory die and the second mold.

Inventor(s): Sanghoon Lee, Yeongbeom Ko, Kyounglim Suk, Seokhyun LEE, Woojin Jang, Gwangjae Jeon

CPC Classification: H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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