COPPER MICROPARTICLE DISPERSION

Abstract: the present invention relates to a copper fine particle dispersion containing copper nanoparticles a, a carboxylic acid b having not less than 6 and not more than 14 carbon atoms, a compound c represented by the formula (1): ro—(chcho)—ch—cooh wherein r is a hydrocarbon group having not less than 6 and not more than 14 carbon atoms, and n represents an average molar number of addition of ethyleneoxy groups, and is a number of not less than 0.5 and not more than 20, and a dispersion medium d, in which the dispersion medium d contains at least one compound selected from the group consisting of a (poly)alkylene glycol, a (poly)alkylene glycol derivative, a terpene alcohol, glycerin and a glycerin derivative, a content of the carboxylic acid b in the dispersion is not less than 0.1% by mass, a content of the compound c in the dispersion is not less than 0.05% by mass, and a total content of the carboxylic acid b and the compound c in the dispersion is not more than 8% by mass, and also relates to a method for producing a bonded body, which includes the steps of allowing the aforementioned copper fine particle dispersion to intervene between a plurality of metal members, and heating the dispersion between the plurality of metal members.

Inventor(s): Takaaki EYAMA, Osamu TAKIGUCHI, Tomohide YOSHIDA

CPC Classification: H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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