SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

Abstract: a semiconductor power device, includes: a substrate including a first direction and a second direction orthogonal to each other; a first conductive region including a first transverse section and a second transverse section; a second conductive region, the second conductive region and the first conductive region spaced apart on the substrate; the second conductive region including a third transverse section and a fourth transverse section; and the first transverse section, the third transverse section, the second transverse section, and the fourth transverse section disposed in the first direction, where the first conductive region and the second conductive region are configured to transmit dc signals; at least one first power chip connected to the first transverse section and the third transverse section; and at least one second power chip connected to the second transverse section and the fourth transverse section.

Inventor(s): Chunjiang LIU, Chong ZHANG, Jianli ZHANG

CPC Classification: H01L23/49596 (Lead-frames {or other flat leads ( takes precedence; lead frame interconnections between components )})

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