SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER

Abstract: a described example includes: a package substrate including a mounting pad, at least one die pad, a first set of conductive leads, and a second set of conductive leads spaced from the first set of conductive leads; a semiconductor die mounted to the at least one die pad with a first die attach material; a laminate transformer with integral magnetic material mounted on the mounting pad with a second die attach material; first electrical connections of wire bonds or ribbon bonds between the bond pads of the semiconductor die and the first set of conductive leads; second electrical connections of wire bonds or ribbon bonds between the bond pads of the semiconductor die and the laminate transformer with integral magnetic material; and mold compound covering the electrical connections, the semiconductor die, the laminate transformer with integral magnetic material and portions of the package substrate.

Inventor(s): Chun Ping Lo, Enis Tuncer, Yi Yan

CPC Classification: H01L23/49575 (Lead-frames {or other flat leads ( takes precedence; lead frame interconnections between components )})

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