THERMAL ENHANCED ELECTRONIC DEVICE PACKAGE

Abstract: an electronic device includes: opposite first and second sides; opposite third and fourth sides; a molded package structure; a semiconductor die having a backside metal structure exposed outside the molded package structure along the second side; and conductive metal first leads along the third and fourth sides, each one of the first leads having a first portion and a second portion, the first portion having a side exposed outside the molded package structure along the first side, and the second portion enclosed by the molded package structure and spaced apart from the first side by a non-zero distance.

Inventor(s): Ashok Prabhu, Hau Nguyen

CPC Classification: H01L23/49541 (Lead-frames {or other flat leads ( takes precedence; lead frame interconnections between components )})

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