Lead Frame

Abstract: a lead frame for a semiconductor assembly includes a first columnar array of die paddles and a second columnar array of die paddles. the die paddles in the first columnar array are offset from the die paddles in the second columnar array. each die paddle has a first pad and a second pad. the first pad is larger than the second pad. the first pads in the first columnar array are offset from the first pads in the second columnar array.

Inventor(s): Shun Tik Yeung

CPC Classification: H01L23/49524 (Lead-frames {or other flat leads ( takes precedence; lead frame interconnections between components )})

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