ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Abstract: the present disclosure discloses an electronic package and a manufacturing method thereof. an electronic component is disposed on a substrate, an encapsulation layer covers the electronic component, and a frame that is not in contact with the substrate is embedded in the encapsulation layer, thereby preventing the electronic package from warping by the frame resisting thermal stress.

Inventor(s): Chien-Wei HSIEH, Ko-Wei CHANG, Wen-Yang LI, Chih-Hsien CHIU, Chia-Yang CHEN, Chin-Wen LAI

CPC Classification: H01L23/3171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

Search for rejections for patent application number 20250183109