20250183089. Manufacturing M (BOE Technology Group ., .)
MANUFACTURING METHOD OF LIGHT-EMITTING DIODE SUBSTRATE, DISPLAY DEVICE
Abstract: a manufacturing method of light-emitting diode substrate and a display device are disclosed. the manufacturing method of the light-emitting diode substrate includes: obtaining an epitaxial layer group of m light-emitting diode chips grown on a substrate; transferring n epitaxial layer groups on n substrates onto a transition carrier substrate, the n epitaxial layer groups on the n substrates being densely arranged on the transition carrier substrate; and transferring at least part of light-emitting diode chips corresponding to the n epitaxial layer groups on the transition carrier substrate onto a driving substrate; the light-emitting diode chips corresponding to the n epitaxial layer groups on the n substrates are configured to emit light of a same color; m is a positive integer greater than or equal to 2, and n is a positive integer greater than or equal to 2.
Inventor(s): Haixu LI, Xiao ZHANG, Fei WANG, Mingxing WANG, Shulei LI, Xue DONG, Guangcai YUAN, Zhanfeng CAO, Xin GU, Ke WANG, Feng QU, Xuan LIANG, Junwei YAN
CPC Classification: H01L21/6835 ({using temporarily an auxiliary support})
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- Patent Applications
- BOE Technology Group Co., Ltd.
- CPC H01L21/6835
- Haixu LI of Beijing CN
- Xiao ZHANG of Beijing CN
- Fei WANG of Beijing CN
- Mingxing WANG of Beijing CN
- Shulei LI of Beijing CN
- Xue DONG of Beijing CN
- Guangcai YUAN of Beijing CN
- Zhanfeng CAO of Beijing CN
- Xin GU of Beijing CN
- Ke WANG of Beijing CN
- Feng QU of Beijing CN
- Xuan LIANG of Beijing CN
- Junwei YAN of Beijing CN