METHOD FOR REMOVING RESIDUES FROM A SUBSTRATE SURFACE

Abstract: the disclosure is related to removing a temporary polymer bonding layer from a dielectric or hybrid bonding surface of a process wafer including a plurality of dies which are to be bonded to other dies or to a substrate by hybrid bonding or direct dielectric-to-dielectric bonding. producing an auxiliary layer precedes the production of the polymer bonding layer on the die side of the wafer, e.g. on the bonding surfaces of the dies. according to the disclosure, the auxiliary layer is formed of a nitride or a carbide of a transition metal, for example titanium nitride or tungsten carbide. these materials enable removing the auxiliary layer including any polymer residue, without negatively affecting the dielectric or hybrid dielectric and/or metal bonding surfaces of the dies.

Inventor(s): Efrain Altamirano Sanchez, Quoc Toan Le

CPC Classification: H01L21/6835 ({using temporarily an auxiliary support})

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