AUTOMATED MATERIAL HANDLING SYSTEM

Abstract: a method of transporting a first carrier is provided. the method includes responsive to a processing station being scheduled to receive a semiconductor wafer that is carried by the first carrier, moving a first transport vehicle from a first track to a second track via a first junction while the first carrier is supported by a first carrier support component of the first transport vehicle. the method includes transferring the first carrier from the first carrier support component to the buffer support component while the first transport vehicle is engaged with the second track. the method includes responsive to the processing station being available to receive the semiconductor wafer, transferring the first carrier from the buffer support component to a second carrier support component of the second transport vehicle. the method includes transferring the first carrier from the second carrier support component to the processing station.

Inventor(s): Yu-Zhu LIN, Chieh HSU, Guancyun LI, Ching-Jung CHANG

CPC Classification: H01L21/67766 ({Mechanical parts of transfer devices (robots in general in )})

Search for rejections for patent application number 20250183078