CHAMBER ARRANGEMENTS WITH UPPER AND LOWER PYROMETERS, SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING CHAMBER ARRANGEMENTS, AND MATERIAL LAYER DEPOSITION METHODS

Abstract: a chamber arrangement includes a chamber body having a substrate support arranged therein to seat thereon a substrate during deposition of a material layer onto the substrate, an upper heater element array supported above the chamber body and configured to heat the substrate, and an upper pyrometer supported above the chamber body and operably coupled to the upper heater element array to acquire a substrate temperature measurement of the substrate. a lower heater element array is supported below the chamber body to heat the substrate support and a lower pyrometer is supported below the chamber body and configured to acquire a non-contact substrate support temperature measurement. semiconductor processing systems, material layer deposition methods, and computer program products are also described.

Inventor(s): Yanfu Lu, Alexandros Demos

CPC Classification: H01L21/67248 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)})

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