SUBSTRATE COOLING APPARATUS USING CONDUCTION AND RADIANCE

Abstract: an apparatus for cooling substrates is presented. the apparatus comprising: a chamber housing; a first port disposed in the first wall configured to be sealable from a first environment; a second port disposed in the second wall configured to be sealable from a second environment; a first support disposed between the top and the bottom of the chamber housing; a second support disposed between the first support and the bottom of the chamber housing; a first body disposed just below the top wall; and a second body disposed just above the bottom wall, wherein an emissivity of the first body and an emissivity of the second body are equal to or greater than a predetermined threshold.

Inventor(s): Mandar Vijay Deshpande, Samer Banna, Mitsunao Shibasaki

CPC Classification: H01L21/67201 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)})

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