APPARATUS FOR HEAT-TREATING SUBSTRATE AND APPARATUS FOR TREATING SUBSTRATE

Abstract: disclosed is a substrate heat-treating apparatus including: a housing having a first lateral portion and a second lateral portion facing the first lateral portion; a heating unit located adjacent the second lateral portion and including a bake plate heating a substrate; and a capture module installed in the second lateral portion and for capturing fumes contained in gas exhausted from the heating unit.

Inventor(s): Kyung Taek IM, Seung Jun LEE, Su Jin AHN

CPC Classification: H01L21/67103 ({mainly by conduction})

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