SUBSTRATE PROCESSING APPARATUS

Abstract: a substrate processing apparatus, comprising a chamber (), a substrate tray (), a megasonic emission device () and a cleaning device (). the substrate tray () is set in the chamber (), and it is used to carry a substrate (). the megasonic emission device () is used to transfer megasonic energy to the chemical solution between the megasonic emission device () and the substrate (). the cleaning device () is used to clean the megasonic emission device (), which includes an electrostatic conductor assembly (), and the conductor assembly () is disposed in the cleaning device () and is used for electrically connecting with the megasonic emission device (), so as to conduct the charges away from the megasonic emission device (), thereby preventing damaging defects on the surface of the substrate () due to discharge of the charges accumulated on the megasonic emission device ().

Inventor(s): Hui Wang, Yang Liu, Xideng He, Haibo Hu, Xiaoyan Zhang, Fuping Chen

CPC Classification: H01L21/6704 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)})

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