CROSS-WAFER RDLS IN CONSTRUCTED WAFERS

Abstract: a method includes placing a plurality of package components over a carrier, encapsulating the plurality of package components in an encapsulant, forming a light-sensitive dielectric layer over the plurality of package components and the encapsulant, exposing the light-sensitive dielectric layer using a lithography mask, and developing the light-sensitive dielectric layer to form a plurality of openings. conductive features of the plurality of package components are exposed through the plurality of openings. the method further includes forming redistribution lines extending into the openings. one of the redistribution lines has a length greater than about 26 mm. the redistribution lines, the plurality of package components, the encapsulant in combination form a reconstructed wafer.

Inventor(s): Chen-Hua Yu, Tin-Hao Kuo

CPC Classification: H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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