Semiconductor Device Comprising Interconnect Structures

Abstract: a system substrate package, a system package, and methods of forming the same are described herein. the system substrate package includes an integrated substrate with multiple discrete interconnect structures. in embodiments the multiple discrete interconnect structures are placed and encapsulated and have a gap formed between the multiple discrete interconnect structures. the system substrate package reduces package warpage and mitigates board level reliability issues.

Inventor(s): Jiun Yi Wu, Chen-Hua Yu

CPC Classification: H01L21/52 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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