ELECTRONIC COMPONENT, CIRCUIT BOARD ARRANGEMENT, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

Abstract: an electronic component includes an element body having a contour having a pair of end faces and multiple lateral faces each of which is connected to the end faces and extends from one of the end faces to another of the end faces, and at least one conductor within the element body; base layers each of which is in contact with the lateral faces and one of the end faces; and ni layers formed on the base layers, respectively, each of the ni layers disposed over the lateral faces and the corresponding end face. each of the ni layers has at least one thickest portion disposed over at least one of the lateral faces, and a thickness of the thickest portion is at least 30 percent greater than a thickness of a portion of the ni layer disposed over the corresponding end face.

Inventor(s): Ryosuke HOSHINO, Satoshi KOBAYASHI

CPC Classification: H01G4/2325 (CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric ; capacitors having potential barriers ))

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