SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Abstract: a semiconductor device includes a first substrate; a memory cell array, a second substrate, and a back-side power distribution network. the memory cell array includes memory cells that are vertically stacked over the first substrate. the second substrate including a front side facing the memory cell array and a back side at a higher level than the front side. the second substrate further includes a plurality of control circuits for controlling the memory cells. the back-side power distribution network includes a power interconnection that penetrates the second substrate and supplies power to the control circuits from the back side of the second substrate. the memory cell array is electrically connected to the plurality of control circuits of the second substrate by a bonding structure.

Inventor(s): Hong Seong KANG, Byung Ho LEE, Ilsup JIN, Jin Won PARK, Kang Sik CHOI

CPC Classification: G11C5/06 (STATIC STORES (semiconductor memory devices ))

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