HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD

Abstract: provided is a technique that, when heat-treating a substrate including an exposed resist film formed on a surface of the substrate and exhibiting a change in solubility of an exposed portion or an unexposed portion in a liquid developer by reacting with water and being heated, is capable of promoting the change in the solubility. for this purpose, a heat treatment apparatus includes: a stage on which the substrate w is placed and heated; a lifting mechanism configured to relatively raise and lower the substrate w between a first position at which the substrate is placed on the stage and a second position spaced apart from the stage; and a gas supply configured to supply a first gas having a humidity higher than that of an atmosphere in which the stage is provided, to the substrate w located at the second position before moving to the first position.

Inventor(s): Shinichiro KAWAKAMI, Yohei SANO, Tomoya ONITSUKA

CPC Classification: G03F7/38 (Treatment before imagewise removal, e.g. prebaking {( takes precedence)})

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