PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF, AND PHOTONIC INTEGRATED CIRCUIT CHIP

Abstract: disclosed are a packaging structure and a manufacturing method thereof, and a photonic integrated circuit chip (). the manufacturing method of the packaging structure includes: providing a photonic integrated structure () including first openings () and a conductive material disposed in each first opening (); providing a first substrate () including second openings () and a conductive material () disposed in each second opening (); and bonding the photonic integrated structure () and the first substrate () such that each first opening () is aligned with a corresponding second opening () and the conductive material in the first opening () is electrically connected with the conductive material () in the corresponding second opening ().

Inventor(s): Dadi SETIADI, Jianhua WU, Zhan SU, Zhiquan XUE, Robert PATTI

CPC Classification: G02B6/4248 (Coupling light guides with opto-electronic elements)

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