MANAGING BACK-SIDE PROCESSING OF PHOTONIC INTEGRATED CIRCUITS

Abstract: an article of manufacture comprises a bottom volume comprising a first region composed of a first material characterized by a first index of refraction (ior) and having a first thickness, and thinned regions in which a portion of the first material is absent or has a thickness less than the first thickness; a middle volume on top of the bottom volume and comprising a second material characterized by a second ior smaller than the first ior; and a top volume on top of the middle volume and comprising alignment structures, and a photonic structure; where the top and middle volumes are in contact at an interface plane, and spatial coordinates specify two-dimensional positions, within at least one thinned region in a second plane parallel to the interface plane and with respect to the alignment structures, of portions of the photonic structure in a first plane parallel to the interface plane.

Inventor(s): Charles Baudot, Alexandre D. Simard, Elnaz Afsharipour, Jonathan Cauchon

CPC Classification: G02B6/12004 (of the integrated circuit kind (electric integrated circuits ))

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