TORSIONAL SHEAR TESTING FOR SEMICONDUCTOR SURFACE BONDS

Abstract: a method of testing semiconductor surface bonds includes centering a torsional shear tool with respect to a first die having a surface bond to a wafer, clamping the first die using the torsional shear tool, applying a torsional load to the first die with respect to the wafer using the torsional shear tool, and measuring a torque value associated with the torsional load.

Inventor(s): Christopher Michael Netzband, Adam Gildea, Ilseok Son

CPC Classification: G01N3/22 (INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing processes other than immunoassay, involving enzymes or microorganisms , ))

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