20250180288. Substrate Processing Ap (Tokyo Electron Limited)
SUBSTRATE PROCESSING APPARATUS, FLUID SUPPLY SYSTEM, AND SUBSTRATE PROCESSING METHOD
Abstract: a substrate processing apparatus includes a processing chamber configured to accommodate a substrate; a supply flow path configured to supply a processing fluid into the processing chamber; a heating mechanism configured to heat the processing fluid flowing through the supply flow path; a first temperature sensor configured to detect a temperature of the processing fluid downstream of the heating mechanism; a pressure sensor configured to detect a pressure of the processing fluid downstream of the heating mechanism; and a controller. the controller controls an output of the heating mechanism based on the pressure of the processing fluid detected by the pressure sensor and the temperature of the processing fluid detected by the first temperature sensor.
Inventor(s): Takahiro HAYASHIDA, Mikio NAKASHIMA, Shigeru MORIYAMA
CPC Classification: F26B5/005 ({by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids ( takes precedence; using chemical vapours or gases )})
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