HIGH TEMPERATURE STABLE CURABLE BONDING COMPOSITIONS

Abstract: curable bonding compositions include a free radically polymerizable bis-maleimide resin, a polymerizable siloxane-based release agent, and an optional thermal or ultraviolet free radical initiator. the curable composition is a coatable composition. upon curing, the cured composition is high temperature stable as measured by isothermal tga (thermal gravimetric analysis) having a weight loss of 2.5% or less at a temperature of at least 300� c. for 1 hour and remains releasable by peeling after exposure to at least 300� c. for 1 hour.

Inventor(s): Naichao Li, Ralph R. Roberts, Kazuki Noda

CPC Classification: C09J179/08 (ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine ))

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