20250179100. Tin Compound (MITSUBISHI CHEMICAL)
TIN COMPOUND AND RESIST SOLUTION USING THE SAME, PATTERN FORMING METHOD, THIN FILM, PATTERNED THIN FILM, AND METHOD FOR PRODUCING TIN COMPOUND
Abstract: as a high-performance resist material that can have high purity and uniform solubility, the following tin compound is provided. the tin compound includes: a tin atom; an organic group r; and at least one of an oxo-ligand and a hydroxo-ligand, wherein the tin compound has a diffraction angle 2� (�) of a peak with a strongest intensity between 5.00 to 15.00� in x-ray diffraction measurement, the strongest intensity peak has a half-value width of 1.00 to 4.00�, and the organic group r has 1 to 30 carbon atoms.
Inventor(s): Yuta HIOKI
CPC Classification: C07F7/2224 (ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM (metal-containing porphyrins ))
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