MEMS CANTILEVER-ENCLOSURE SPACING

Abstract: a microphone device includes a substrate, a microelectromechanical system (mems) transducer supported by the substrate, the mems transducer including a cantilever, the cantilever having a length, and an enclosure structure that encapsulates the mems transducer. a spacing between the cantilever and the enclosure structure is greater than the length of the mems transducer.

Inventor(s): Yuhai Mei, Alena Gracheva, Mohamed El Badawe, Carly Stalder

CPC Classification: B81B3/0056 (Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes ( takes precedence))

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