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20250178110. Enhanced Solder Paste Dispen (Intel)

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ENHANCED SOLDER PASTE DISPENSING TOOL AND METHOD

Abstract: a solder paste cartridge is disclosed that includes a body with a connection arm and a chamber, which has a front wall with a first angled bottom panel and a back wall with a second angled bottom panel that form an unpartitioned space. in an aspect, a first lower edge of the first angled bottom panel and a second lower edge of the second angled bottom panel form an aperture for the chamber. in another aspect, a pushing member may be positioned between the front and back walls of the chamber and may have a first angled bottom surface and a second angled bottom surface. the pushing member may move from an upper position to a lower position in the chamber, which positions the first and second angled bottom surfaces of the pushing member approximal to the first and second angled bottom panels of the chamber.

Inventor(s): Thanh Tan NGUYEN

CPC Classification: B23K3/0638 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal ; building up linings or coverings by casting ; casting by dipping ; manufacture of composite layers by sintering metal powder ; arrangements on machine tools for copying or controlling ; covering metals or covering materials with metals, not otherwise provided for ; burners ))

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