FEEDTHROUGH ASSEMBLY AND DEVICE INCLUDING SAME

Abstract: various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. the assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. the assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. the feedthrough pin extends beyond the outer surface of the header.

Inventor(s): Andrew J. Ries, Chunho Kim, Robert A. Munoz, Christopher T. Kinsey, Jeffrey Voss, Kris A. Peterson, Mark E. Henschel

CPC Classification: A61N1/3754 (ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY (measurement of bioelectric currents ; surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body ; anaesthetic apparatus in general ; incandescent lamps ; infrared radiators for heating ))

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