20250176431. Method Producing Donor Substrate (Soitec)
METHOD FOR PRODUCING A DONOR SUBSTRATE FOR TRANSFERRING A PIEZOELECTRIC LAYER, AND METHOD FOR TRANSFERRING A PIEZOELECTRIC LAYER TO A CARRIER SUBSTRATE
Abstract: a method of manufacturing a donor substrate for the transfer of a piezoelectric layer onto a support substrate comprises providing a handling substrate and a piezoelectric substrate. a surface activation treatment is carried out on the surface of the piezoelectric substrate to form an activated surface on the piezoelectric substrate. a polymer layer is deposited on the activated surface of the piezoelectric substrate or on the handling substrate. the piezoelectric substrate is then assembled on the handling substrate in such a way that the polymer layer is between the activated surface of the piezoelectric substrate and the handling substrate. the donor substrate may be used to transfer a layer of piezoelectric material from the donor substrate onto a support substrate.
Inventor(s): Marcel Broekaart, Cédric Charles-Alfred, Luciana Capello, Morgane Logiou, Thierry Barge
CPC Classification: H10N30/073 (by fusion of metals or by adhesives)
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