HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

Abstract: a high frequency module includes a mounting substrate, a first electronic component, a second electronic component, a third electronic component, and a side surface shield electrode. the mounting substrate has a first main surface and a second main surface which face each other. the first electronic component is disposed on the first main surface. the second electronic component is disposed on the first main surface. the third electronic component is disposed between the first electronic component and the second electronic component on the first main surface. the side surface shield electrode is provided on at least one side surface of the third electronic component. the mounting substrate includes a ground layer. the side surface shield electrode is connected to the ground layer.

Inventor(s): Nanami YUMURA, Takanori UEJIMA, Shogo YANASE, Yuusuke KISHI, Masaki TADA, Mizuki KINOSHITA, Ryoya SHIOMI

CPC Classification: H04B1/006 ({using switches for selecting the desired band ( takes precedence)})

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