ACOUSTIC WAVE DEVICE, HIGH FREQUENCY MODULE, AND COMMUNICATION DEVICE

Abstract: an acoustic wave device includes a substrate, an outer connection electrode arranged on a first principal surface of the substrate, and an outer shield layer arranged on side surfaces of the substrate. the substrate has the first principal surface and a second principal surface that are mutually opposed, and the side surfaces connecting the first principal surface and the second principal surface together. the outer connection electrode has a tip surface exposed.

Inventor(s): Shogo YANASE, Mizuki KINOSHITA, Takanori UEJIMA, Ryoya SHIOMI, Yuusuke KISHI, Masaki TADA, Nanami YUMURA

CPC Classification: H03H9/059 (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (measuring, testing ; arrangements for producing a reverberation or echo sound ; impedance networks or resonators consisting of distributed impedances, e.g. of the waveguide type, ; control of amplification, e.g. bandwidth control of amplifiers, ; tuning resonant circuits, e.g. tuning coupled resonant circuits, ; networks for modifying the frequency characteristics of communication systems ))

Search for rejections for patent application number 20250175143