APPARATUS, SYSTEM, AND METHOD FOR REDUCING THE FOOTPRINTS OF CIRCUITS THAT PROTECT AGAINST THE ANTENNA EFFECT AND ELECTROSTATIC DISCHARGE

Abstract: an exemplary apparatus includes a through-silicon via (tsv) and circuit that protects against the antenna effect and electrostatic discharge (esd). the circuit can include a plurality of transistors whose gates are each electrically coupled to a signal that passes through the tsv. various other apparatuses, systems, and methods are also disclosed.

Inventor(s): Stephen Dussinger, William E. Laub, JR., John Wuu

CPC Classification: H02H9/046 ({responsive to excess voltage appearing at terminals of integrated circuits (protection by specific structural integration design )})

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