20250174883. Low-cost Radome Materials Fab (VIASAT, .)
LOW-COST RADOME MATERIALS AND FABRICATION PROCESSES
Abstract: radome structures comprising a structural layer comprising a fiber reinforced thermoplastic composite including a fiber reinforcement and a thermoplastic resin. in addition, one or more rf matching layers may be disposed on at least one side of the structural layer. the rf matching layer comprising a first dielectric constant value that is lower than that a dielectric constant value of the structural layer. in this regard, the rf matching layer may provide smaller discrete changes in dielectric constant through a thickness of the radome to provide enhanced rf performance. in an example, a resin content of the thermoplastic resin of the fiber reinforced thermoplastic composite is not fewer than 25 weight percent and not more than about 60 weight percent, which provides enhanced rf performance relative to structural performance of the radome. in turn, manufacturing cost and complexity may be reduced by use of the thermoplastic materials as described herein.
Inventor(s): Jared VICTOR, Michael SCAMARDO, Donald L. RUNYON, Emily BLICKENSTAFF, Martin GIMERSKY, Frank KLEFENZ, Gary MILLER, Juddson C. FROST, James G Coffin, April A. SPERA, Joseph M. CARLSON
CPC Classification: H01Q1/422 ({comprising two or more layers of dielectric material ( takes precedence)})
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- Patent Applications
- VIASAT, INC.
- CPC H01Q1/422
- Jared VICTOR of La Costa CA US
- Michael SCAMARDO of Irvine CA US
- Donald L. RUNYON of Duluth GA US
- Emily BLICKENSTAFF of Suwanee GA US
- Martin GIMERSKY of Morges CH
- Frank KLEFENZ of Zurich CH
- Gary MILLER of Peachtree Corners GA US
- Juddson C. FROST of San Diego CA US
- James G Coffin of Solana Beach CA US
- April A. SPERA of San Diego CA US
- Joseph M. CARLSON of Flagstaff AZ US