ELECTRONIC DEVICE

Abstract: an electronic device includes a transparent core substrate and a first buffer layer. the transparent core substrate includes a through hole, wherein the transparent core substrate includes a first transparent core layer and a second transparent core layer. the first transparent core layer includes a first sub-through hole. the second transparent core layer is bonded to the first transparent core layer, wherein the second transparent core layer includes a second sub-through hole, and the first sub-through hole overlaps the second sub-through hole to form the through hole. the first buffer layer is disposed in at least a part of the through hole.

Inventor(s): Po-Yun HSU, Ju-Li Wang

CPC Classification: H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials }))

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