LEAD FRAME AND MANUFACTURING METHOD THEREOF

Abstract: a lead frame includes a die pad on which a semiconductor element is mountable and a lead portion located around the die pad. a first rough surface is formed at, at least, a part of a front surface of the die pad. a third rough surface is formed at a side surface of the die pad. the third rough surface of the die pad is rougher than the first rough surface of the die pad such that a roughness value based on an s ratio of the third rough surface indicates more roughness than a roughness value based on an s ratio of the first rough surface.

Inventor(s): Masahiro NAGATA, Kazuhiro SHINOZAKI, Masahiro YAMADA, Daisuke OKUYAMA, Chiaki HATSUTA, Kentarou SEKI, Hideto MATSUI, Kazunori OOUCHI

CPC Classification: H01L23/49582 (Lead-frames {or other flat leads ( takes precedence; lead frame interconnections between components )})

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