METHOD OF TESTING SEMICONDUCTOR PACKAGE

Abstract: a method of testing a semiconductor package includes: attaching a charge measurement unit to a carrier substrate; forming a first metallization layer over the charge measurement unit, wherein the forming of the first metallization layer induces first charges to accumulate on the charge measurement unit; performing a first test against the charge measurement unit to determine whether breakdown occurs in the charge measurement unit; and in response to determining that no breakdown occurs in the charge measurement unit, forming a second metallization layer over the first metallization layer.

Inventor(s): CHI-HUI LAI, YANG-CHE CHEN, CHEN-HUA LIN, VICTOR CHIANG LIANG, CHWEN-MING LIU

CPC Classification: H01L22/20 ({Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps})

Search for rejections for patent application number 20250174499