SUBSTRATE PROCESSING APPARATUS

Abstract: a substrate processing apparatus includes: a processing unit that processes a substrate; and a controller that controls the processing unit, wherein the processing unit includes: a plate having an upper surface; a rotation driver that rotates the plate; a support that protrudes upward from the plate, is in contact with at least one of a lower surface of the substrate and an edge of the substrate, and supports the substrate at a position higher than the upper surface of the plate; a gas outlet that is formed on the upper surface of the plate and blows gas upward; a blowing adjuster that adjusts a flow rate of the gas; and a detector that detects a force received from the substrate when a suction force according to bernoulli's principle acts on the substrate, and the controller controls the processing unit based on information on the force received from the substrate.

Inventor(s): Yuichi TAKAYAMA, Hiroyuki KAWAHARA, Takuya SATO

CPC Classification: H01L21/6838 (for supporting or gripping (for conveying , for positioning, orientation or alignment ))

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